Features of CFD-1T-B

  • The minimum flow of 1mL/shot offers greater accuracy in chemical condensation control that is required in the wafer cleaning process. The CFD-1T-B always feeds the correct quantity of chemical without overshot eliminating excess liquid wastage. In addition, the anti-siphon mechanism prevents unintentional siphoning.
  • The fluoroplastic wet end (PTFE, PFA, PCTFE) is capable of handling strong acids, alkalis and hydrogen peroxide, typical chemicals required for semiconductor processing. PTFE, PFA, PP, PVC external parts and PTFE coated screws provide additional protection against chemical attack from harsh environments.
  • Adjustment of the stroke length to give between 1.0-2.7mL/shot is simple by removal of the bottom cover (Factory default is 1.0mL/shot).
  • Every unit is equipped with a leakage sensor to immediately detect a leak.

Specifications

Max. discharge capacity 1 mL/shot
Max. discharge pressure 0.05 MPa
Max. stroke speed 30 spm
Main materials PTFE, PFA, PCTFE
Liquid temperature range 20 – 60˚C
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