Max. discharge capacity: 8 mL/shot Excellent performance for strong acid and alkali replenishment in semiconductor manufacturing
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Accurately dispenses the minimum required amount of chemical. Ideal for controlling the concentration of wafer cleaning solution. The pump prevents the concentration overshooting and contributes to cost reduction of the solution.
All wet end parts are made of fluoroplastic (PTFE, PFA, PCTFE) and are compatible with chemicals such as strong acid, strong alkali and hydrogen peroxide. The outer parts of the pump are made of plastic with coated bolts.
The pump is a pneumatic drive bellows pump safely powered by compressed air. The siphon prevention mechanism prevents the outflow of chemical. CFD-1T-B is equipped as standard with a leak sensor that detects bellows damage.
The discharge capacity can be flexibly adjusted for a wide range. Factory default setting is as follows; CFD-1T-B: 1 mL/shot, CFD-8T-B: 8 mL/shot.
| Model | CFD-1T-B | CFD-8T-B |
|---|---|---|
| Max. discharge capacity | 1 mL/shot*1 | 8 mL/shot*2 |
| Max. discharge pressure | 0.05 MPa | |
| Max. stroke speed | 30 spm | |
| Main materials | PTFE, PFA, PCTFE | |
| Liquid temperature range | 20 – 60°C | |
*1 Factory default setting. The discharge capacity can be changed within 0.4 to 2.7 mL/shot.
*2 Factory default setting. The discharge capacity can be changed from 7 to 10 mL/shot.
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