Features of CFD series

Resolution improvement
The resolution of the CFD-1T-B has been greatly improved compared to our existing models. The minimum flow of 1mL/shot offers greater accuracy in chemical condensation control that is required in the wafer cleaning process. The CFD-1T-B always feeds the correct quantity of chemical without overshoot, eliminating excess liquid wastage. In addition, the anti-siphon mechanism prevents unintentional siphoning.

 

Corrosion resistant wet ends
Fluoroplastic wet ends (PTFE, PFA, PCTFE) is capable of handling the strong acids, alkalines and hydrogen peroxide required for semiconductor processing.
PTFE, PFA, PP, PVC external parts and PTFE coated screws provide additional protection against chemical attack.
Flow rate adjustment
Simply open the bottom cover to easily adjust stroke length to give between 1.0 – 2.7ml/shot. (Factory default is 1.0ml/shot)

 

Leak sensor
Every unit is equipped with a leakage sensor to detect any leakage immediately.

Specifications

Max. discharge capacity 1 mL/shot
Max. discharge pressure 0.05 MPa
Max. stroke speed 30 spm
Main materials PTFE, PFA, PCTFE
Liquid temperature range 20 – 60℃

Product information

Catalogs and Download
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