Features of FS-100HT2

  • Maximum flow rate of up to 100 L/min with 180˚C liquid. This allows delivery of CARO (SPM) or H3PO4 at a flow rate 1.8 times higher than our existing pumps (55 L/min).
  • Higher flow rates improve cleaning efficiency and removal of containments during wafer processing. Cleaning times are also reduced in systems with multiple processing lines.
  • In addition to the use of fluoroplastic wet ends (PTFE and PFA), a fluorine coating on the pump’s outer surfaces offers the best resistance to vapors from acid, alkali and hydrogen peroxide chemistries used in semiconductor manufacturing.
  • Optimization of design has resultind in reduced weight of about 15% of our existing 80-100L models making installation and replacement work easier.
  • The pump uses a proximity sensor drive system which opens/closes an external air solenoid valve providing easy performance control capabilities that are compatible with a variety of controller options.

Specifications

Max. discharge capacity 100 L/min
Air supply pressure range 0.15 − 0.5 MPa
Liquid temperature range 10 – 180˚C
Max. air consumption 1210 NL/min
Max. stroke speed Note 120 spm
Main materials PTFE, PFA

Note: Max. discharge capacity shows when pumping clear water at  20˚C.

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