Features of FS-100HT2

Enhanced cleaning efficiency
Cleaning efficiency such as the removal of particles and metal contamination on wafers is improved as the circulation flow rate is increased. Cleaning times resulting from increased number of processing lines will also be reduced due to higher circulation rate.
Contamination-free
In addition to the use of fluoroplastic wet ends (PTFE and PFA), a fluorine coating on the pump’s outer surfaces offers the best resistance to vapors from acid, alkali and hydrogen peroxide chemistries used in semiconductor manufacturing.
Reduced installation area
In addition to the use of fluoroplastic wet ends (PTFE and PFA), a fluorine coating on the pump’s outer surfaces offers the best resistance to vapors from acid, alkali and hydrogen peroxide chemistries used in semiconductor manufacturing
Weight saving
Optimization of design has resultind in reduced weight of about 15% of our existing 80-100L models making installation and replacement work easier.

Specifications

Max. discharge capacity 100 L/min
Max. supplied air pressure 0.15 − 0.5 MPa
Max. stroke speed Note 120 spm
Main materials PTFE, PFA
Liquid temperature range 10 – 180˚C

Note: Max. discharge capacity shows when pumping clear water at  20˚C.

Product information

Catalogs and Download
Product data, catalogs, and instruction manuals can be downloaded from the member site.
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about our fluid control devices including chemical pumps.